| Booth No.: 4-162 |
Highlights of exhibition
We show you various samples bonded at room temperature in our booth.
The atomic diffusion bonding of two flat substrates surfaces with thin metal films is a promising process to achieve sold substrates bonding at room temperature. This process is originally proposed for semiconductor or ceramic wafers-bonding in order to fabricate new thin film devices, and now actually used for mass production. In this process, thin metal films are sputter deposited on two flat surfaces, and the bonding of the two metal films on the wafers is accomplished in vacuum or in air, dependently on the metal films materials used for the bonding. Any mirror-polished wafers can be bonded using thin metal films at room temperature without a loading pressure.
We applied this room temperature bonding method to bonding mirror-polished solid substrates: bonding of metals to metals, ceramics to ceramics, and ceramics to metals can be achieved using this process although a loading pressure is necessary. This bonding process holds great potential for fabricating new machinery components in addition to new devices.
Exhibiting Product / Technology
Category of products
（1）Audio-Visual home appliances
④Main Materials、⑤Processing Technologies, Materials and Equipment、⑥Manufacturing Equipment
（2）Communications Equipment
④Main Materials、⑤Processing Technologies, Materials and Equipment、⑥Manufacturing Equipment
（3）PCs and IT Devices
④Main Materials、⑤Processing Technologies, Materials and Equipment、⑥Manufacturing Equipment
（5）Medical Equipment
④Main Materials、⑤Processing Technologies, Materials and Equipment、⑥Manufacturing Equipment
（6）Automotive
④Main Materials、⑤Processing Technologies, Materials and Equipment、⑥Manufacturing Equipment
（7）Smart Sensing Product Category - ②IT, Networks
2. Semiconductors/electronic devices
（7）Smart Sensing Product Category - ③Automotive electronics
2. Semiconductors/electronic devices
（7）Smart Sensing Product Category - ④Energy, Power, Gas, Water Supply
2. Semiconductors/electronic devices
（7）Smart Sensing Product Category - ⑤Bio, Healthcare
2. Semiconductors/electronic devices
* The following information is released for the purpose of the prior appointment
and inquiry from a visitor to an exhibition person.
It prohibits firmly without notice from using and reproducing for the other purpose
(sales etc.).
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Tohoku University Frontier Research Institute for Interdisciplinary Sciences Shimatsu Laboratory Tohoku University, FRIS, Shimatsu-lab. Aramaki Aza-Aoba 6-3, Aoba-ku, Sendai Tohoku University, FRIS 980-8577 Japan |
TEL: 022-217-5494 FAX: 022-217-5486 Email : lab.shimatsu@fris.tohoku.ac.jp |
