| Booth No.: 4-222 |
Highlights of exhibition
All electronic devices use electronic circuit boards with very small components such as IC chips and fine wiring. In recent years, it has begun to be used for parts and substrates for IoT and 5G devices, and volume expansion is expected in the future. As a leading manufacturer of electrolytic copper foils, we always lead the market with a wide product lineup and development capabilities, ranging from general-purpose products to advanced products that enable ultra-fine circuit formation and products coated with resin on copper foil.Contents of the exhibition
1) Ultra-thin copper foil with carrier (MicroThin)
suitable for MSAP process with excellent circuit narrowing and circuit formability for 5G & IoT, IC package and HDI substrates
2) Capacitor material for built-in printed wiring board (FaradFlex)
suitable for reducing signal noise on server and router boards, micro MEMS microphone boards
3) Copper foil for flexible substrates for high frequency transmission (VSP Series),
4) Copper foil for high density wiring board (MLS-G2,HS2-VSP)
5) Introduction of high frequency characteristics evaluation technology launched by our company
---NPI Presentation https://jpca2019.jcdbizmatch.jp/SeminarDetail/jp?val=t4XeZJrsAlI
Exhibiting Product / Technology
Category of products
（2）Communications Equipment
①Finished Products、④Main Materials、⑤Processing Technologies, Materials and Equipment
（3）PCs and IT Devices
③Reliability and Inspection Technologies、④Main Materials
（6）Automotive
①Finished Products、④Main Materials、⑤Processing Technologies, Materials and Equipment
News Release
Mitsui Kinzoku Completes Increase in Production Capacity of VSP®
E-190604VSPの生産体制増強について(Final)-20190607.pdf
* The following information is released for the purpose of the prior appointment
and inquiry from a visitor to an exhibition person.
It prohibits firmly without notice from using and reproducing for the other purpose
(sales etc.).
|
MITSUI MINING & SMELTING Engineered Materials Sector Copper Foil Division Business Planning Groupe 656-2 Futatsumiya Ageo Saitama, Japan 3620017 Japan |
TEL: +81-9025480472 FAX: +81-487772710 |
